Lead-free electronic soldersSUBRAMANIAN, K. N.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, issn 0957-4522, 366 p.Serial Issue

Filler materials : the current situation and future trends with particular reference to lead-free soldering alloysZACCARIA, B.Welding international. 2001, Vol 15, Num 7, pp 545-550, issn 0950-7116Article

New metallurgical systems for electronic soldering applicationsGONCALVES, C; FERREIRA, J; FORTUNATO, E et al.Sensors and actuators. A, Physical. 1999, Vol 74, Num 1-3, pp 70-76, issn 0924-4247Conference Paper

On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parametersDI MAIO, D; HUNT, C. P.Soldering & surface mount technology. 2009, Vol 21, Num 4, pp 24-31, issn 0954-0911, 8 p.Article

Reliability and microstructure of lead-free solder die attach interface in silicon power devicesHUFF, D; KATSIS, D; STINSON-BAGBY, K et al.IEEE international reliability physics symposium. 2004, pp 567-568, isbn 0-7803-8315-X, 1Vol, 2 p.Conference Paper

Analysis of ring and plug shear strengths for comparison of lead-free soldersFOLEY, J. C; GICKLER, A; LEPREVOST, F. H et al.Journal of electronic materials. 2000, Vol 29, Num 10, pp 1258-1263, issn 0361-5235Conference Paper

Determining solder alloy and base metal compatibilitySHAPIRO, Alexander E.Welding journal. 2007, Vol 86, Num 9, pp 33-34, issn 0043-2296, 2 p.Article

Lead-Free Solders and Materials Issues in Microelectronic PackagingJournal of electronic materials. 2002, Vol 31, Num 11, pp 1129-1308, issn 0361-5235, 180 p.Conference Proceedings

Experiments and simulations of uniaxial ratchetting deformation of Sn-3Ag-0.5Cu and Sn-37Pb solder alloysKOBAYASHI, Takuji; SASAKI, Katsuhiko.Journal of materials science. Materials in electronics. 2009, Vol 20, Num 4, pp 343-353, issn 0957-4522, 11 p.Article

Rapid assessment of steady-state creep rates and stress dip effects in solder alloysGREASLEY, A.Journal of materials science. Materials in electronics. 2002, Vol 13, Num 1, pp 43-47, issn 0957-4522Article

Surface tension and density of binary lead and lead-free Sn-based soldersKABAN, I; MHIAOUI, S; HOYER, W et al.Journal of physics. Condensed matter (Print). 2005, Vol 17, Num 50, pp 7867-7873, issn 0953-8984, 7 p.Article

Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixingTAY, S. L; HASEEB, A. S. M. A; MOHD RAFIE JOHAN et al.Soldering & surface mount technology. 2011, Vol 23, Num 1, pp 10-14, issn 0954-0911, 5 p.Article

Pb-Free Synthesis: Decision Matrix as a Tool for Alloy SelectionQUINTERO, Pedro O; VALENTIN, Ricky; MA, David et al.Journal of microelectronics and electronic packaging. 2010, Vol 7, Num 1, pp 25-34, issn 1551-4897, 10 p.Article

Reliability evaluation of CSP soldered joints based on FEM and Taguchi methodHUAN YE; SONGBAI XUE; LIANG ZHANG et al.Computational materials science. 2010, Vol 48, Num 3, pp 509-512, issn 0927-0256, 4 p.Article

An investigation of Sn pest in pure Sn and Sn-based soldersWEIQUN PENG.Microelectronics and reliability. 2009, Vol 49, Num 1, pp 86-91, issn 0026-2714, 6 p.Article

Bottom-up Nanoconstruction by the Welding of Individual Metallic Nanoobjects Using Nanoscale SolderYONG PENG; CULLIS, Tony; INKSON, Beverley et al.Nano letters (Print). 2009, Vol 9, Num 1, pp 91-96, issn 1530-6984, 6 p.Article

Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates : RECENT RESEARCH ADVANCES IN Pb-FREE SOLDERSWANG, Y. W; LIN, Y. W; KAO, C. R et al.Microelectronics and reliability. 2009, Vol 49, Num 3, pp 248-252, issn 0026-2714, 5 p.Article

Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive dropsYEH, Chang-Lin; LAI, Yi-Shao.Microelectronics and reliability. 2008, Vol 48, Num 2, pp 282-292, issn 0026-2714, 11 p.Article

Dissolution of copper on Sn-Ag-Cu system lead free solderIZUTA, Goro; TANABE, Tsuyoshi; SUGANUMA, Katsuaki et al.Soldering & surface mount technology. 2007, Vol 19, Num 2, pp 4-11, issn 0954-0911, 8 p.Article

Dissolution and interface reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb solders on silver base metalVIANCO, Paul T; MARTIN, Joseph J; WRIGHT, Robert D et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2006, Vol 37, Num 5, pp 1551-1561, issn 1073-5623, 11 p.Article

The formation of none-Ag₃Sn particles on the intermetallic compounds during wetting reactionYU, D. Q; WANG, L; WU, C. M. L et al.Journal of alloys and compounds. 2005, Vol 389, pp 153-158, issn 0925-8388, 6 p.Article

Power law indentation creep of Sn-5% Sb solder alloyGERANMAYEH, A. R; MAHMUDI, R.Journal of materials science. 2005, Vol 40, Num 13, pp 3361-3366, issn 0022-2461, 6 p.Article

Lead-free solder flip chips on FR-4 substrates with different surface finishes, underfills and fluxesSJOBERG, Jonas; GEIGER, David A; SHANGGUAN, Dongkai et al.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 31-36, isbn 0-7803-8582-9, 1Vol, 6 p.Conference Paper

Thermodynamic properties of liquid Al-Sn-Zn alloys: A possible new lead-free solder material : Lead-free electronics packagingKNOTT, Sabine; MIKULA, Adolf.Materials transactions - JIM. 2002, Vol 43, Num 8, pp 1868-1872, issn 0916-1821Article

Design and operation of a droplet deposition system for freeform fabrication of metal partsTSENG, A. A; LEE, M. H; ZHAO, B et al.Journal of engineering materials and technology. 2001, Vol 123, Num 1, pp 74-84, issn 0094-4289Article